| Component Type | Typical Specifications |
| Main MCU/MPU | BGA 10×10mm ;8-core ARM; 1.5GHz–3.0GHz |
| Flash & RAM Memory | BGA 6×8mm ; UFS 64GB; LPDDR4 4GB |
| Communication IC | QFN 4×4mm ; Wi-Fi 6/6E + Bluetooth 5.3 |
| FPC Connectors | 2×6mm ; 20–40Pin; 0.3mm pitch (for display, camera, etc.) |
| PMIC / DC-DC IC | QFN4×4mm; Input 3.7V; Multi-rail outputs (0.8V–3.3V); Max charging 2A–3A |
| Crystal Oscillator | SMD 2.0×1.6mm ; 19.2MHz system clock; 32.768kHz RTC |
| Resistors & Capacitors | SMD 01005; Resistance 10Ω–10MΩ; Capacitance 1pF–100µF |
| TVS & Rectifier Diodes | SMD 0201; 5V/12V ESD protection; Schottky diodes, forward voltage ≤0.3V |
