| Component Type | Typical Specifications |
| Modem IC | BGA 10×10mm; 4G LTE Cat4/Cat6 / 5G NR Sub-6GHz |
| RF Transceiver IC | QFN 5×5mm; Supports LTE/5G bands |
| RF Front-End Module (FEM) | QFN 4×4mm; Power amplifier, filter, switch integrated; 23dBm max output power |
| Flash & RAM Memory | BGA 5×6mm; NOR/NAND Flash 16GB; LPDDR3 512MB |
| PMIC / DC-DC IC | QFN 3×3mm; Input 5V; Multi-rail outputs (1.2V~3.3V); Max 1A |
| Crystal Oscillator | SMD 3.2×2.5mm; 26MHz TCXO (RF reference); 32.768kHz RTC |
| SIM Card Socket | SMD 6Pin; 3FF form factor; ISO 7816 compliant |
| Board-to-Board/FPC Connector | 16 Pin; 0.5mm pitch; M.2 or proprietary form factor |
| Resistors & Capacitors | SMD 0201; Resistance 10Ω–1MΩ; Capacitance 1pF–10µF |
| Inductors (RF & Power) | SMD 0402; RF inductors 1–100nH; Power inductors 1–10µH |
| TVS & ESD Protection Diodes | SMD 0402; 5V ESD protection; Low leakage |
